https://www.tomshardware.com/new ... grated-watercooling
As transistors get increasingly compressed together due to denser manufacturing technologies and added vertical 3D chip stacking, temperature becomes an increasingly critical problem to address. TSMC's researchers think the solution is allowing water to flow in-between sandwiched circuits. It's an incredibly simple theoretical solution, but is an extremely difficult engineering feat to pull off safely --for the electronics, that is.
晶体管的高密度和3D堆叠使得积热问题尤其严重。台积电研究员认为解决方法就是把电路做成三明治结构，水道从中间流过（汽车发动机原理类似）。这是一个非常简单的理论，只不过可靠地实施起来比较困难
The mathematics are simple: Current cooling solutions typically work via direct contact with a given chip's heatspreader, direct die contact technologies, or full submersion in a non-conducting fluid. Of these, the first two solutions can only efficiently cool the layers they're directly in contact with, which brings huge problems for vertical chip stacking. The lower layers will have much more trouble dissipating their heat, with of damage or having to throttle, either of which would be bad for performance.
数学计算很简单：现在的水冷都是和die或者顶盖接触，只能冷却他们直接接触的那层电路。对于3D堆叠电路是有严重问题的，下层无法解热，要么损坏，要么出发温度上限，无论哪种情况都对性能有影响
TSMC carried out testing on a dummy semicondutor - a Thermal Test Vehicle (TTV), which is essentially a heating element made out of copper - in controlled lab conditions. The company tested three types of silicon water channel integration in controlled conditions: It used a pillar-based channel, where water could flow around active semiconductor pillars to cool them down (think of water around an island); a design which featured a trench design (think of a river, controlled by its shores); and a simple, flat water channel on top of the rest of the silicon chip. The water was passed through an external cooling mechanism that chilled the water down to 25 ºC from its journey through the silicon chips.
台积电在受控实验室条件下，对一个半导体假体进行了测试，本质上是一种由铜制成的加热元件。该公司在控制变量下测试了三种类型的水道方案：
1. 使用柱状水道，水可以围绕半导体圆柱流来冷却（想象在岛屿周围的水）
2. 以沟渠设计为特色的设计（想象一条由其海岸控制的河流）
3. 硅芯片其余部分顶部的简单平坦的水通道
水通过外循环来冷却，控制水温在25度
The company further tested three types of water cooling designs: one with only direct water cooling (DWC), where water has its own circulating channels etched directly into the chip's silicon as part of the manufacturing process; another design with water channels being etched into their own silicon layer on top of the chip proper, with a Thermal Interface Material (TIM) layer of OX (Silicon Oxide Fusion) that carried heat from the chip to the watercooling layer; and lastly a design which swapped the OX layer for a simpler, cheaper liquid metal solution.
该公司还测试了三种类型的水冷却设计：
1. 只有直接水冷却（DWC），其中水有自己的循环通道，直接蚀刻在芯片的硅作为制造过程的一部分
2. 另一种设计是将水道蚀刻在芯片顶部的硅层中，并带有一个氧氧化硅（氧化硅聚变）的热接口材料（TIM）层，将热量从芯片输送到水冷层
3. 最后是一种设计，它把OX层换成了更简单、更便宜的液态金属溶液
TSMC reported that the best solution was by far the direct water cooling method, which could dissipate up to 2.6 kW of heat and offered a temperature delta of 63 ºC. The second-best design was naturally the OX TIM-based one, which could still dissipate up to 2.3 kW of heat and offered a temperature delta of 83 ºC. The liquid metal solution came in last, still managing to dissipate up to 1.8 kW (temperature delta of 75 º C). Of all the water flow designs, the pillar-based one was the best by far.
台积电表示，目前最好的解决方案是直接水冷却方法，可解高达2.6千瓦的热量，温升为63°C。第二好的设计自然是OX TIM，它仍然可以消散高达2.3千瓦的热量，并提供83°C的温度增量。液态金属溶液排最后，仍然能够消散高达1.8千瓦（温升为75°C）。在所有的水道设计中，基于圆柱的设计是迄今为止最好的。
参考图片：
评论
想法很好，但是感觉以现在这个面积很难切出来足够的水道，解决积热还是要扩大面积
评论
这台积电真是有钱有闲，这是专利占坑吧，不是早就有更保险的氟化液封装顶盖了么？
这晶圆利用率太低了，用于散热的面积不会打折吧？
评论
芯片内水冷？
评论
那么点量随时都在气化液化循环？
评论
水冷穿芯片？
评论
一回路
评论
以后电脑坏，真的会爆炸了
评论
这冷却液得纯净到什么程度
评论
直接泡在3M的氟化液里面不就好了。。。
机箱上部做用冷凝管把气化的氟化液冷却还原成液态，然后热管把热量导出去。。。
服务器成熟产品
下放到民用就好了
评论
意思就是以后cpu封装里面也有微水路了呗，那不是封装企业噩梦？
评论
如果以后的cpu直接把一部分散热方案集成进die里面，这样再加盖以后就不会有什么散热瓶颈了
评论
不行的散热能力还是不够的，底层还是没有办法直接导热出去
评论
不行的散热能力还是不够的，底层还是没有办法直接导热出去 电路 电子 维修 求创维42c08RD电路图 评论 电视的图纸很少见 评论 电视的图纸很少见 评论 创维的图纸你要说 版号，不然无能为力 评论 板号5800-p42ALM-0050 168P-P42CLM-01 电路 电子 维修 我现在把定影部分拆出来了。想换下滚，因为卡纸。但是我发现灯管挡住了。拆不了。不会拆。论坛里的高手拆解过吗？ 评论 认真看，认真瞧。果然有收
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